Home > News & Events 12 Mar 2022

“Optimising the Resist and Dedication Allocation for Capacity Maximisation in a Wafer Fabrication Plant” – D-SIMLAB’s novel, heuristic-based optimisation approach to automate the process of optimising layer to tool dedication and corresponding resist installations in the lithography area of a semiconductor wafer fab will be presented at the 20th European Advanced Process Control and Manufacturing Process (apc|m) Conference, to be held during 4-6 April 2022 in Toulon, France.

The optimisation approach achieves a trade-off between the risk of capacity loss and/or excessive cycle time increase caused by tool downs (in case too few tools are dedicated to a particular product/layer) and the probability of having to carry out additional pilot runs (in case more tools than necessary are dedicated to a particular product/layer) by considering four conflicting objectives:

(1) Balancing tool utilisation,

(2) Minimising the risk of no-run-path due to tool downs,

(3) Minimising number of pilot runs,

(4) Minimising resist installation and the associated cost,

thereby considering a wide range of factors that are critical to managing and optimising the lithography area of a fab.

The solution can be used not just to optimise the photo dedication in a high-load situation but also to determine which tools can be shut down temporarily in a lower fab-load situation to achieve cost saving without losing cycle time.

The implementation of the D-SIMCON Photo Optimiser has enabled to free up close to 5% additional photo capacity in the 200mm wafer fab operated by Tower Partners Semiconductor Company (TPSCo) in Japan.

For further details and registration information please click here.


For further enquiries please contact:

Dr Peter Lendermann, Chief Business Development Officer, peter@d-simlab.com